In this report, LP Information covers the present scenario (with the base year being 2017) and the growth prospects of global System in Package market for 2018-2023.
A system in package (SiP) is a number of integrated circuits enclosed in a single module (package).
The SiP performs all or most of the functions of an electronic system, and is typically used inside a mobile phone and digital music player.
Over the next five years, LPI(LP Information) projects that System in Package will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.
This report presents a comprehensive overview, market shares, and growth opportunities of System in Package market by product type, application, key manufacturers and key regions.
To calculate the market size, LP Information considers value and volume generated from the sales of the following segments:
Segmentation by product type:
2D IC
2.5D IC
3D IC
Segmentation by application:
Consumer Electronics
Communications
Automotive & Transportation
Industrial
Aerospace & Defense
Healthcare
Emerging & Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Spain
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The report also presents the market competition landscape and a corresponding detailed analysis of the major vendor/manufacturers in the market. The key manufacturers covered in this report:
Amkor Technology
ASE
Chipbond Technology
Chipmos Technologies
FATC
Intel
JCET
Powertech Technology
Samsung Electronics
Spil
Texas Instruments
Unisem
UTAC
In addition, this report discusses the key drivers influencing market growth, opportunities, the challenges and the risks faced by key manufacturers and the market as a whole. It also analyzes key emerging trends and their impact on present and future development.
Research objectives
To study and analyze the global System in Package consumption (value & volume) by key regions/countries, product type and application, history data from 2013 to 2017, and forecast to 2023.
To understand the structure of System in Package market by identifying its various subsegments.
Focuses on the key global System in Package manufacturers, to define, describe and analyze the sales volume, value, market share, market competition landscape, SWOT analysis and development plans in next few years.
To analyze the System in Package with respect to individual growth trends, future prospects, and their contribution to the total market.
To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
To project the consumption of System in Package submarkets, with respect to key regions (along with their respective key countries).
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
Table of Contents
2018-2023 Global System in Package Consumption Market Report
1 Scope of the Report
1.1 Market Introduction
1.2 Research Objectives
1.3 Years Considered
1.4 Market Research Methodology
1.5 Economic Indicators
1.6 Currency Considered
2 Executive Summary
2.1 World Market Overview
2.1.1 Global System in Package Consumption 2013-2023
2.1.2 System in Package Consumption CAGR by Region
2.2 System in Package Segment by Type
2.2.1 2D IC
2.2.2 2.5D IC
2.2.3 3D IC
2.3 System in Package Consumption by Type
2.3.1 Global System in Package Consumption Market Share by Type (2013-2018)
2.3.2 Global System in Package Revenue and Market Share by Type (2013-2018)
2.3.3 Global System in Package Sale Price by Type (2013-2018)
2.4 System in Package Segment by Application
2.4.1 Consumer Electronics
2.4.2 Communications
2.4.3 Automotive & Transportation
2.4.4 Industrial
2.4.5 Aerospace & Defense
2.4.6 Healthcare
2.4.7 Emerging & Others
2.5 System in Package Consumption by Application
2.5.1 Global System in Package Consumption Market Share by Application (2013-2018)
2.5.2 Global System in Package Value and Market Share by Application (2013-2018)
2.5.3 Global System in Package Sale Price by Application (2013-2018)
3 Global System in Package by Players
3.1 Global System in Package Sales Market Share by Players
3.1.1 Global System in Package Sales by Players (2016-2018)
3.1.2 Global System in Package Sales Market Share by Players (2016-2018)
3.2 Global System in Package Revenue Market Share by Players
3.2.1 Global System in Package Revenue by Players (2016-2018)
3.2.2 Global System in Package Revenue Market Share by Players (2016-2018)
3.3 Global System in Package Sale Price by Players
3.4 Global System in Package Manufacturing Base Distribution, Sales Area, Product Types by Players
3.4.1 Global System in Package Manufacturing Base Distribution and Sales Area by Players
3.4.2 Players System in Package Products Offered
3.5 Market Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) (2016-2018)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 System in Package by Regions
4.1 System in Package by Regions
4.1.1 Global System in Package Consumption by Regions
4.1.2 Global System in Package Value by Regions
4.2 Americas System in Package Consumption Growth
4.3 APAC System in Package Consumption Growth
4.4 Europe System in Package Consumption Growth
4.5 Middle East & Africa System in Package Consumption Growth
5 Americas
5.1 Americas System in Package Consumption by Countries
5.1.1 Americas System in Package Consumption by Countries (2013-2018)
5.1.2 Americas System in Package Value by Countries (2013-2018)
5.2 Americas System in Package Consumption by Type
5.3 Americas System in Package Consumption by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Key Economic Indicators of Few Americas Countries
6 APAC
6.1 APAC System in Package Consumption by Countries
6.1.1 APAC System in Package Consumption by Countries (2013-2018)
6.1.2 APAC System in Package Value by Countries (2013-2018)
6.2 APAC System in Package Consumption by Type
6.3 APAC System in Package Consumption by Application
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 Key Economic Indicators of Few APAC Countries
7 Europe
7.1 Europe System in Package by Countries
7.1.1 Europe System in Package Consumption by Countries (2013-2018)
7.1.2 Europe System in Package Value by Countries (2013-2018)
7.2 Europe System in Package Consumption by Type
7.3 Europe System in Package Consumption by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
7.9 Spain
7.10 Key Economic Indicators of Few Europe Countries
8 Middle East & Africa
8.1 Middle East & Africa System in Package by Countries
8.1.1 Middle East & Africa System in Package Consumption by Countries (2013-2018)
8.1.2 Middle East & Africa System in Package Value by Countries (2013-2018)
8.2 Middle East & Africa System in Package Consumption by Type
8.3 Middle East & Africa System in Package Consumption by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 Market Drivers, Challenges and Trends
9.1 Market Drivers and Impact
9.1.1 Growing Demand from Key Regions
9.1.2 Growing Demand from Key Applications and Potential Industries
9.2 Market Challenges and Impact
9.3 Market Trends
10 Marketing, Distributors and Customer
10.1 Sales Channel
10.1.1 Direct Marketing
10.1.2 Indirect Marketing
10.2 System in Package Distributors
10.3 System in Package Customer
11 Global System in Package Market Forecast
11.1 Global System in Package Consumption Forecast (2018-2023)
11.2 Global System in Package Forecast by Regions
11.2.1 Global System in Package Forecast by Regions (2018-2023)
11.2.2 Global System in Package Value Forecast by Regions (2018-2023)
11.2.3 Americas Consumption Forecast
11.2.4 APAC Consumption Forecast
11.2.5 Europe Consumption Forecast
11.2.6 Middle East & Africa Consumption Forecast
11.3 Americas Forecast by Countries
11.3.1 United States Market Forecast
11.3.2 Canada Market Forecast
11.3.3 Mexico Market Forecast
11.3.4 Brazil Market Forecast
11.4 APAC Forecast by Countries
11.4.1 China Market Forecast
11.4.2 Japan Market Forecast
11.4.3 Korea Market Forecast
11.4.4 Southeast Asia Market Forecast
11.4.5 India Market Forecast
11.4.6 Australia Market Forecast
11.5 Europe Forecast by Countries
11.5.1 Germany Market Forecast
11.5.2 France Market Forecast
11.5.3 UK Market Forecast
11.5.4 Italy Market Forecast
11.5.5 Russia Market Forecast
11.5.6 Spain Market Forecast
11.6 Middle East & Africa Forecast by Countries
11.6.1 Egypt Market Forecast
11.6.2 South Africa Market Forecast
11.6.3 Israel Market Forecast
11.6.4 Turkey Market Forecast
11.6.5 GCC Countries Market Forecast
11.7 Global System in Package Forecast by Type
11.8 Global System in Package Forecast by Application
12 Key Players Analysis
12.1 Amkor Technology
12.1.1 Company Details
12.1.2 System in Package Product Offered
12.1.3 Amkor Technology System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.1.4 Main Business Overview
12.1.5 Amkor Technology News
12.2 ASE
12.2.1 Company Details
12.2.2 System in Package Product Offered
12.2.3 ASE System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.2.4 Main Business Overview
12.2.5 ASE News
12.3 Chipbond Technology
12.3.1 Company Details
12.3.2 System in Package Product Offered
12.3.3 Chipbond Technology System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.3.4 Main Business Overview
12.3.5 Chipbond Technology News
12.4 Chipmos Technologies
12.4.1 Company Details
12.4.2 System in Package Product Offered
12.4.3 Chipmos Technologies System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.4.4 Main Business Overview
12.4.5 Chipmos Technologies News
12.5 FATC
12.5.1 Company Details
12.5.2 System in Package Product Offered
12.5.3 FATC System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.5.4 Main Business Overview
12.5.5 FATC News
12.6 Intel
12.6.1 Company Details
12.6.2 System in Package Product Offered
12.6.3 Intel System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.6.4 Main Business Overview
12.6.5 Intel News
12.7 JCET
12.7.1 Company Details
12.7.2 System in Package Product Offered
12.7.3 JCET System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.7.4 Main Business Overview
12.7.5 JCET News
12.8 Powertech Technology
12.8.1 Company Details
12.8.2 System in Package Product Offered
12.8.3 Powertech Technology System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.8.4 Main Business Overview
12.8.5 Powertech Technology News
12.9 Samsung Electronics
12.9.1 Company Details
12.9.2 System in Package Product Offered
12.9.3 Samsung Electronics System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.9.4 Main Business Overview
12.9.5 Samsung Electronics News
12.10 Spil
12.10.1 Company Details
12.10.2 System in Package Product Offered
12.10.3 Spil System in Package Sales, Revenue, Price and Gross Margin (2016-2018)
12.10.4 Main Business Overview
12.10.5 Spil News
12.11 Texas Instruments
12.12 Unisem
12.13 UTAC
13 Research Findings and Conclusion
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