The Global Radiation Hardened ICs Market is expected to grow from USD 147.06 Million in 2019 to USD 203.91 Million by 2027, at a CAGR of 4.17% during the forecast period 2020-2027.
Radiation hardened ICs are proficient at enduring harsh radiation effects. The radiation effect on electronic components can be fatal in the field of space and nuclear applications and can cause serious issues in medical imaging applications. Atmospheres with high levels of ionizing radiation would lead to special design challenges. Radiation hardening is a method of building electronics and semiconductors devices resistant to damage caused by radiation. These devices are mostly associated with high altitude applications where radiation could damage the functioning of electronic components. In military and space applications, the microprocessors, switching regulators, and in power supply of satellite system, all need the radiation-tolerant components for proper working. The stopping of gamma radiation and neutron radiation triggered by nuclear reactors is possible due to radiation-hardened components. The power management devices, also the need for transistors, diodes, and MOSFETs in space and defense applications is fuelling the radiation-hardened electronics market. Moreover, technical developments are leading to concentrate on the integration of radiation-hardened electronics chips into various devices. The increase in the number of space missions and communication satellite launches also the ISR missions are driving the market. However, the high capital involvement in testing and making the radiation-hardened electronic devices would act as a major restraint.
The global radiation-hardened ICs market has been segmented on the basis of type, application, and region. The type segment includes memory, microprocessor, microcontrollers, and power management. The power management segment held the largest market share of 47.09% in 2019. Radiation-hardened (rad-hard) ICs used in power conversion and control products are designed for extreme environmental conditions and radiation exposure. The new line of rad-hard power products includes linear voltage regulators with adjustable or fixed output voltages. The application segment includes aerospace, military, space, and nuclear. Large enterprises held the highest market share of 39.34% in 2019. However, aerospace is expected to grow with the highest CAGR of 3.46% during the forecast period. The rise in the number of space missions conducted globally is expected to drive the growth of the radiation-hardened electronics market during the forecast period. The market has been divided into North America, Europe, China, Japan, Rest of APAC, Latin America, and RoW. North America is accounted for the highest market share of 56.15% in 2019.
The market for Global Radiation Hardened ICs market is segmented into key players. Major Player includes Aeroflex Inc., Atmel Corporation, Bae Systems Plc, Crane Co., Honeywell Aerospace, International Rectifier Corporation, RD Alfa Microelectronics, Intersil Corporation, and Linear Technology Corporation.
This study forecasts revenue growth at global, regional, and country levels from 2014 to 2027. Fior Markets has segmented the on the basis of below-mentioned segments:
Chapter 1 Introduction
1.1 Research Methodology
1.2 FMR Desk Research
1.2.1 FMR data synthesis
1.2.2 Data validation and market feedback
1.2.3 FMR Data Sources
Chapter 2 Global Radiation Hardened ICs Market Overview
2.1 Product Overview and Scope of Radiation Hardened ICs
2.2 Commercial Types of Radiation Hardened ICs
2.2.4 Power Management
2.3 Commercial Application of Radiation Hardened ICs
2.4 Market Status and Trend of Radiation Hardened ICs 2014-2027
2.4.1 Global Radiation Hardened ICs Market Status and Trend 2014-2027
2.4.2 Regional Radiation Hardened ICs Market Status and Trend 2014-2027
184.108.40.206 North America Market Status and Trend 2014-2027
220.127.116.11 Europe Market Status and Trend 2014-2027
18.104.22.168 China Market Status and Trend 2014-2027
22.214.171.124 Japan Market Status and Trend 2014-2027
126.96.36.199 Rest of APAC Market Status and Trend 2014-2027
188.8.131.52 Latin America Market Status and Trend 2014-2027
Chapter 3 Global Market Status by Regions
3.1 Market Development of Radiation Hardened ICs 2014-2019
3.2 Production Market of Radiation Hardened ICs by Regions
3.2.1 Production Volume of Radiation Hardened ICs by Regions
3.2.2 Regions Production Value of Radiation Hardened ICs by Regions
3.3 Demand Market of Radiation Hardened ICs by Regions
3.4 Production and Demand Status of Radiation Hardened ICs by Regions
3.4.1 Global Production (Units) and Demand (Units) Status of Radiation Hardened ICs 2014-2019
3.5 Import and Export Status of Radiation Hardened ICs by Regions 2014-2019
3.6 Market Forecast of Radiation Hardened ICs by Regions 2020-2027
3.7.1 Demand Market Forecast of Radiation Hardened ICs by Regions 2020-2027
Chapter 4 Global Radiation Hardened ICs Production by Type
4.1 Production Volume of Radiation Hardened ICs by Types
4.2 Production Value of Radiation Hardened ICs by Types
4.3 Market Forecast of Radiation Hardened ICs by Types
Chapter 5 Global Radiation Hardened ICs Production by Downstream Industry
5.1 Demand Volume of Radiation Hardened ICs by Downstream Industry
5.2 Market Forecast of Radiation Hardened ICs by Downstream Industry
Chapter 6 Market Driving Factor Analysis of Radiation Hardened ICs
6.1 Global Economy Situation and Trend Overview
6.2 Radiation Hardened ICs Downstream Industry Situation and Trend Overview
Chapter 7 Radiation Hardened ICs Market Competition Status by Major Manufacturers
7.1 Production Volume of Radiation Hardened ICs by Major Manufacturers
7.2 Production Value of Radiation Hardened ICs by Major Manufacturers
7.3 Basic Information of Radiation Hardened ICs Major Manufacturers
7.3.1 Plant Location and Established Time of Radiation Hardened ICs Major Manufacturer
7.4 Market Competition News and Trend
Chapter 8 Radiation Hardened ICs Major Manufacturers
8.1 Aeroflex Incorporated (subsidiary of Cobham plc.)
8.1.1 Company Profile
8.1.2 Representative Radiation Hardened ICs Industry Product
8.1.3 Radiation Hardened ICs Industry Sales, Revenue, Price and Gross Margin of Aeroflex Incorporated
8.2 Atmel Corporation
8.2.1 Company Profile
8.2.2 Representative Radiation Hardened ICs Industry Product
8.2.3 Radiation Hardened ICs Industry Sales, Revenue, Price and Gross Margin of Atmel Corporation
8.3 BAE Systems
8.3.1 Company Profile
8.3.2 Representative Radiation Hardened ICs Industry Product
8.3.3 Radiation Hardened ICs Industry Sales, Revenue, Price and Gross Margin of BAE Systems
8.4 Crane Co.
8.4.1 Company Profile
8.4.2 Representative Radiation Hardened ICs Industry Product
8.5 Honeywell Aerospace Inc. (subsidiary of Honeywell International Inc)
8.5.1 Company Profile
8.5.2 Representative Radiation Hardened ICs Industry Product
8.5.3 Radiation Hardened ICs Industry Sales, Revenue, Price and Gross Margin of Honeywell Aerospace Inc.
8.6 International Rectifier an Infineon Technologies Company
8.6.1 Company Profile
8.6.2 Representative Radiation Hardened ICs Industry Product
8.7 RD ALFA Microelectronics
8.7.1 Company Profile
8.7.2 Representative Radiation Hardened ICs Industry Product
8.8 Intersil Corporation (subsidiary of Renesas Electronics Corporation)
8.8.1 Company Profile
8.8.2 Representative Radiation Hardened ICs Industry Product
8.9 Linear Technology Corporation
8.9.1 Company Profile
8.9.2 Representative Radiation Hardened ICs Industry Product
8.10 Maxwell Technologies, Inc.
8.10.1 Company Profile
8.10.2 Representative Radiation Hardened ICs Industry Product
8.10.3 Radiation Hardened ICs Industry Sales, Revenue, Price and Gross Margin of Maxwell Technologies, Inc.
Chapter 9 Upstream and Downstream Market Analysis of Radiation Hardened ICs
9.1.1 Industry Chain of Radiation Hardened ICs
9.2 Upstream Market and Representative Suppliers Analysis
9.2.1 Upstream Raw Material Market Analysis
9.2.2 Upstream Raw Material Representative Suppliers Analysis
9.3 Downstream Market and Representative Companies
9.3.5 Representative Consumers of Radiation Hardened ICs
Chapter 10 Cost and Gross Margin Analysis of Radiation Hardened ICs
10.1 Proportion of Manufacturing Cost Structure
10.1.1 Labor Cost Analysis
10.1.1.1 USA Labor Cost Analysis
10.1 Manufacturing Process Analysis
Chapter 11 Marketing Status Analysis of Radiation Hardened ICs
11.1 Marketing Channel
11.1.1 Direct Marketing
11.1.2 Indirect Marketing
11.2 Market Positioning
11.2.1 Marketing Channel Future Trend
11.2.2 Pricing Strategy
11.2.3 Brand Strategy
11.3 Distributors/Traders List
Chapter 12 Research Findings and Conclusion
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